Electronic device with heat-dissipating unit

ABSTRACT

An electronic device includes a connector-mounting side wall, a main circuit board and a heat-dissipating unit. The connector-mounting side wall is formed with a set of connector-mounting holes adapted to be mounted with electrical connectors, and a vent hole. The main circuit board has one edge disposed adjacent to the connector-mounting side wall, and is provided with a heat-generating electronic component. The heat-dissipating unit includes a heat sink, a heat-conducting plate and a heat-exchanger pipe. The heat sink is mounted on the connector-mounting side wall adjacent to the vent hole. The heat-conducting plate is disposed on the main circuit board so as to contact a heat-dissipating side of the electronic component. The heat-exchanger pipe has a first end connected to the heat-conducting plate, and a second end opposite to the first end and mounted on the heat sink for transmitting heat from the heat-conducting plate to the heat sink.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The invention relates to an electronic device, more particularlyto an electronic device with a heat-dissipating unit that can achieveenhanced heat dissipation economically.

[0003] 2. Description of the Related Art

[0004] The trend of recent developments of notebook computers is towardincreased operational speed of central processing units, more and betterfunctions, and reduced size. However, increased operational speed of thecentral processing unit entails the problem of dissipation of increasedheat generated by the central processing unit during operation withoutincurring additional costs.

SUMMARY OF THE INVENTION

[0005] Therefore, the main object of the present invention is to providean electronic device with a heat-dissipating unit that can achieveenhanced heat dissipation economically.

[0006] Accordingly, the electronic device of this invention includes aconnector-mounting side wall, a main circuit board and aheat-dissipating unit. The connector-mounting side wall is formed with aset of connector-mounting holes adapted to be mounted with electricalconnectors, and a vent hole. The main circuit board has one edgedisposed adjacent to the connector-mounting side wall, and is providedwith a heat-generating electronic component. The heat-dissipating unitincludes a heat sink, a heat-conducting plate and a heat-exchanger pipe.The heat sink is mounted on the connector-mounting side wall adjacent tothe vent hole. The heat-conducting plate is disposed on the main circuitboard so as to contact a heat-dissipating side of the electroniccomponent. The heat-exchanger pipe has a first end connected to theheat-conducting plate, and a second end opposite to the first end andmounted on the heat sink for transmitting heat from the heat-conductingplate to the heat sink.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Other features and advantages of the present invention willbecome apparent in the following detailed description of the preferredembodiment with reference to the accompanying drawings, of which:

[0008]FIG. 1 is a perspective view of the preferred embodiment of anelectronic device according to the present invention;

[0009]FIG. 2 is a perspective view of an assembly of aconnector-mounting side wall and a heat-dissipating unit of thepreferred embodiment;

[0010]FIG. 3 is a rear bottom perspective view of the assembly of FIG.2; and

[0011]FIG. 4 is a perspective view of the preferred embodiment prior tomounting of a heat-conducting plate and a heat-exchanger pipe.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0012] Referring to FIGS. 1 to 4, an electronic device according to thepresent invention is to be embodied in a notebook computer (not shown)and is shown to include a connector-mounting side wall 1, a main circuitboard 2 and a heat-dissipating unit 3.

[0013] The connector-mounting side wall 1 forms a part of a housing ofthe notebook computer, and is formed with a set of connector-mountingholes 11 adapted to be mounted with electrical connectors (not shown),and a vent hole 12. The connector-mounting side wall 1 is preferablymade from a magnesium-aluminum alloy that has good heat conductivity.

[0014] The main circuit board 3 has a rear edge mounted on theconnector-mounting side wall 1, and is provided with a heat-generatingelectronic component 30, such as a central processing unit.

[0015] The heat-dissipating unit 2, which is preferably made from amagnesium-aluminum alloy, includes a heat sink 23, a heat-conductingplate 21 and a heat-exchanger pipe 22. The heat sink 23 is mounted onthe connector-mounting side wall 1 adjacent to the vent hole 12. Theheat-conducting plate 21 is disposed on the main circuit board 3 so asto contact a heat-dissipating side of the electronic component 30. Theheat-exchanger pipe 22 has a first end connected to the heat-conductingplate 21, and a second end opposite to the first end and mounted on theheat sink 23 for transmitting heat from the heat-conducting plate 21 tothe heat sink 23. The heat-conducting plate 21 is formed with aplurality of retaining protrusions 211. The main circuit board 3 isformed with a plurality of retaining holes 31 (see FIG. 4) for engagingthe retaining protrusions 211 so as to retain the heat-conducting plate21 on the main circuit board 3. The heat sink 23 includes a stack ofspaced-apart fin plates 231 which are formed with aligned holes. Thesecond end of the heat-exchanger pipe 22 extends through the alignedholes 232 in the fin plates 231 to transfer the heat from theheat-dissipating plate 21 to the fin plates 231. Preferably, the heatsink 23 is formed integrally with the connector-mounting side wall 1.

[0016] The heat-dissipating unit 2 further includes a heat-dissipatingfan 24 mounted on the connector-mounting side wall 1 between the heatsink 23 and the vent hole 12 to enhance dissipation of heat.

[0017] In use, since the heat sink 23 is mounted on theconnector-mounting side wall 1, which has a relatively large area ofcontact with the ambient air, the heat-dissipating effect is vastlyimproved. Furthermore, compared with the prior art that utilizesconnector-mounting frames which are punched from pig iron and which aretherefore relatively heavy, the connector-mounting side wall 1 has theadvantage of being light-weight without incurring increased costs.

[0018] While the present invention has been described in connection withwhat is considered the most practical and preferred embodiment, it isunderstood that this invention is not limited to the disclosedembodiment but is intended to cover various arrangements included withinthe spirit and scope of the broadest interpretation so as to encompassall such modifications and equivalent arrangements.

I claim:
 1. An electronic device comprising: a connector-mounting sidewall formed with a set of connector-mounting holes adapted to be mountedwith electrical connectors, and a vent hole; a main circuit board havingone edge disposed adjacent to said connector-mounting side wall, saidmain circuit board being provided with a heat-generating electroniccomponent; and a heat-dissipating unit which includes a heat sinkmounted on said connector-mounting side wall adjacent to said vent hole,a heat-conducting plate disposed on said main circuit board so as tocontact a heat-dissipating side of said electronic component, and aheat-exchanger pipe having a first end connected to said heat-conductingplate and a second end opposite to said first end and mounted on saidheat sink for transmitting heat from said heat-conducting plate to saidheat sink.
 2. The electronic device as claimed in claim 1, wherein saidheat-conducting plate is formed with a plurality of retainingprotrusions, said main circuit board being formed with a plurality ofretaining holes for engaging said retaining protrusions so as to retainsaid heat-conducting plate on said main circuit board.
 3. The electronicdevice as claimed in claim 1, wherein said heat sink includes a stack ofspaced-apart fin plates which are formed with aligned holes, said secondend of said heat-exchanger pipe extending through said aligned holes insaid fin plates.
 4. The electronic device as claimed in claim 1, whereinsaid heat sink is formed integrally with said connector-mounting sidewall.
 5. The electronic device as claimed in claim 1, wherein saidheat-dissipating unit and said connector-mounting side wall are eachmade from a magnesium-aluminum alloy.
 6. The electronic device asclaimed in claim 1, wherein said heat-dissipating unit further includesa heat-dissipating fan mounted on said connector-mounting side wallbetween said heat sink and said vent hole.